可靠性测试报告
Reliability Test Report
1.5H SIM卡有档 测试项目： 功能测试
样品品名：
测试日期：
2012-10-15
Shenzhen City COTEX Industrial Co., Ltd. Department of Laboratory Quality Assurance Page 1 of 1
第二篇：AOD4454可靠性测试报告
AOS Semiconductor
Product Reliability Report
AOD4454, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
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This AOS product reliability report summarizes the qualification result for AOD4454. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD4454 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I. Product Description
II. Package and Die information
III. Environmental Stress Test Summary and Result
IV. Reliability Evaluation
I. Product Description:
The AOD4454 combines advanced trench MOSFET with a low resistance package to provide extremely low RDS(ON).This device is ideal for boost converters and synchronous rectifiers for consumer, telecom, industrial power supplies and LED backlighting.
-RoHS Compliant
-Halogen Free
Details refer to the datasheet.
II. Die / Package Information:
AOD4454
Process Standard sub-micron
Low voltage N channel process
Package Type 3 leads TO252 Lead Frame Bare Cu
Die Attach Soft solder
Bond wire Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
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III. Result of Reliability Stress for AOD4454
Test Item MSL
Precondition
HTRB
HAST
130 +/- 2°c , 85%RH,
33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, RH=100% -65°c to 150°c , air to air, Temp = 150°c , Vds=80% of Vdsmax
Test Condition
Time Point -
500 hrs 1000 hrs
168hrs 500 hrs 1000 hrs 100 hrs
Lot Attribution
9 lots 2 lots
(Note A*) 1 lot 2 lots
(Note A*) 9 lots
(Note A*) 5 lots
(Note A*) 8 lots
(Note A*)
Total
Sample size
1210pcs
77 pcs / lot 231pcs
77 pcs / lot 495pcs
55 pcs / lot 275pcs
55 pcs / lot 440pcs
55 pcs / lot
168hr 85°c
/85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax
Number of
Failures
0Reference Standard
JESD22-A113 A108
0 JESD22-A108
JESD22-A110
Pressure Pot Temperature Cycle
96 hrs 0
JESD22-A102 JESD22-A104
250 / 500 cycles
IV. Reliability Evaluation
FIT rate (per billion): 20 MTTF = 5790 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD4454). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)]
= 1.83 x 109 / [2x (2x77x168+2x2x77x500) x258] = 20 97
MTTF = 10 / FIT = 5.07 x 10hrs = 5790 years
Chi2 = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list:
55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C
Af 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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